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ULEZWE LOMkhiqizo
Amabhodi Esifunda Aphrintiwe (ama-PCB) awumgogodla wemishini yesimanje kagesi. Bahlinzeka ngenkundla yezingxenye ze-elekthronikhi ukuze zixhumane futhi zisebenze ndawonye. Empeleni, i-PCB iyibhodi eliyisicaba elenziwe ngezinto ezivikelayo, njenge-fiberglass, enezingqimba ezincane zamathrekhi ethusi aqoshwe noma aphrintwe ebhodini. Lawa mathrekhi ethusi adala izindlela zokuthi imisinga kagesi igeleze phakathi kwezingxenye ezihlukene njengama-resistors, ama-capacitor, ama-circuits ahlanganisiwe, nokunye.
Ama-PCB aklanywe kusetshenziswa isofthiwe ye-computer-aid design (CAD), ebeka izingxenye kanye nokuxhumana kwazo. Uma umklamo usulungile, inqubo yokwenziwa kwe-PCB iyaqala. Lokhu kuhilela izinyathelo ezimbalwa:
Ukulungiselela I-Substrate: Ungqimba oluncane lwethusi lufakwe emgqeni we-substrate (ngokuvamile i-fiberglass noma impahla eyinhlanganisela).
I-Etching: I-copper engadingeki ikhishwa kusetshenziswa inqubo yamakhemikhali, ishiya ngemuva amathrekhi ethusi aklanyelwe.
Ukubhoboza: Izimbobo ezincane ziyabhobozwa ukuze kufakwe izingxenye ze-elekthronikhi nokudala ukuxhumana kukagesi phakathi kwezingqimba ezihlukene zebhodi.
Ukukhweza Ingxenye: Izingxenye ze-elekthronikhi zidayiswa ebhodini kusetshenziswa imishini ezenzakalelayo noma ngesandla.
Ukuhlola: Ibhodi elihlanganisiwe liyahlolwa ukuze kuqinisekiswe ukuthi konke ukuxhumana kusungulwe kahle futhi awekho amaphutha.
Ama-PCB aklanywe kusetshenziswa isofthiwe ye-computer-aid design (CAD), ebeka izingxenye kanye nokuxhumana kwazo. Uma umklamo usulungile, inqubo yokwenziwa kwe-PCB iyaqala. Lokhu kuhilela izinyathelo ezimbalwa:
Ukulungiselela I-Substrate: Ungqimba oluncane lwethusi lufakwe emgqeni we-substrate (ngokuvamile i-fiberglass noma impahla eyinhlanganisela).
I-Etching: I-copper engadingeki ikhishwa kusetshenziswa inqubo yamakhemikhali, ishiya ngemuva amathrekhi ethusi aklanyelwe.
Ukubhoboza: Izimbobo ezincane ziyabhobozwa ukuze kufakwe izingxenye ze-elekthronikhi nokudala ukuxhumana kukagesi phakathi kwezingqimba ezihlukene zebhodi.
Ukukhweza Ingxenye: Izingxenye ze-elekthronikhi zidayiswa ebhodini kusetshenziswa imishini ezenzakalelayo noma ngesandla.
Ukuhlola: Ibhodi elihlanganisiwe liyahlolwa ukuze kuqinisekiswe ukuthi konke ukuxhumana kusungulwe kahle futhi awekho amaphutha.
I-Semiconductor Plating DSA
Igama lomkhiqizo: Semiconductor Plating DSA
Ukubuka konke komkhiqizo: i-roll-to-roll plating, i-plating yedivayisi yokuxhumana, i-lead frame plating, i-electropolishing, i-select spot plating, njll.
Izici zomkhiqizo: Ingakhethwa futhi yenziwe ngezifiso ngokwezidingo zakho. Ukuma kwe-anode kungenziwa ngokwezifiso ngokuya ngezidingo zekhasimende.
Amaphuzu avelele: impilo ende, ukusetshenziswa kwamandla okuphansi, ukufana okuphezulu kwe-plating, izindleko eziphansi zokusetshenziswa okuphelele, nokusebenza okumba eqolo.
Izimo ezisebenzayo: I-semiconductor component plating: i-roll-to-roll plating, i-plating yedivayisi yokuxhumana, i-lead frame plating, i-electropolishing, i-select spot plating, njll.
Izimo zohlelo lokusebenza: I-Electrolyte: isistimu ye-acidic/cyanide, i-gloss agent nezinye izithasiselo PH: 4-5; izinga lokushisa 30-70 ℃;
Ukuminyana kwamanje: 250-30000A/m2;
Uhlobo lwe-Coating: i-anode yensimbi eyigugu exubene ne-plating ye-platinum anode, ukujiya kweplatinamu kungaba yi-lum-10um, noma kukhulu nakakhulu.
Ukuthengiswa komkhiqizo ngemva kokuthengiswa kanye nesevisi: Sihlinzeka ngesikhathi kanye nekhwalithi ephezulu yokukhiqiza i-anode entsha kanye nezinsizakalo ezindala zokuhlanganisa i-anode emhlabeni jikelele.
Buka NginiUkubuka konke komkhiqizo: i-roll-to-roll plating, i-plating yedivayisi yokuxhumana, i-lead frame plating, i-electropolishing, i-select spot plating, njll.
Izici zomkhiqizo: Ingakhethwa futhi yenziwe ngezifiso ngokwezidingo zakho. Ukuma kwe-anode kungenziwa ngokwezifiso ngokuya ngezidingo zekhasimende.
Amaphuzu avelele: impilo ende, ukusetshenziswa kwamandla okuphansi, ukufana okuphezulu kwe-plating, izindleko eziphansi zokusetshenziswa okuphelele, nokusebenza okumba eqolo.
Izimo ezisebenzayo: I-semiconductor component plating: i-roll-to-roll plating, i-plating yedivayisi yokuxhumana, i-lead frame plating, i-electropolishing, i-select spot plating, njll.
Izimo zohlelo lokusebenza: I-Electrolyte: isistimu ye-acidic/cyanide, i-gloss agent nezinye izithasiselo PH: 4-5; izinga lokushisa 30-70 ℃;
Ukuminyana kwamanje: 250-30000A/m2;
Uhlobo lwe-Coating: i-anode yensimbi eyigugu exubene ne-plating ye-platinum anode, ukujiya kweplatinamu kungaba yi-lum-10um, noma kukhulu nakakhulu.
Ukuthengiswa komkhiqizo ngemva kokuthengiswa kanye nesevisi: Sihlinzeka ngesikhathi kanye nekhwalithi ephezulu yokukhiqiza i-anode entsha kanye nezinsizakalo ezindala zokuhlanganisa i-anode emhlabeni jikelele.
I-PCB Gold Plating DSA
Igama lomkhiqizo: PCB Gold Plating
Ukubuka konke komkhiqizo: Thuthukisa ukuqhutshwa kwe-conductivity, ukumelana ne-oxidation, nokumelana nokugqokwa kwamabhodi wesekethe ukuze kuhlangatshezwane nezidingo zabo zokusetshenziswa ngezikhathi ezikhethekile.
Izici zomkhiqizo: ukusebenza okuhle kakhulu, ukusebenza kahle kwe-electrocatalytic, umthamo we-antioxidant, nokuzinza.
Amaphuzu avelele: impilo ende, ukusetshenziswa kwamandla okuphansi, ukufana okuphezulu kwe-plating, izindleko eziphansi zokusetshenziswa okuphelele, nokusebenza okumba eqolo.
Izimo ezisebenzayo: ibhodi lesifunda ipulatizo legolide
Izimo zohlelo lokusebenza: isistimu ye-electrolyte acidic/cyanide, i-gloss agent nezinye izithasiselo Au: 4-10g/L, CN: ukuhlushwa okuphansi, PH: 4-5; izinga lokushisa 40-60 ℃;
Ukuminyana kwamanje: 0.1-1.0ASD; isilinganiso 0.2ASD
Ukuthengiswa komkhiqizo ngemva kokuthengiswa kanye nesevisi: Sihlinzeka ngesikhathi kanye nekhwalithi ephezulu yokukhiqiza i-anode entsha kanye nezinsizakalo ezindala zokuhlanganisa i-anode emhlabeni jikelele.
Buka NginiUkubuka konke komkhiqizo: Thuthukisa ukuqhutshwa kwe-conductivity, ukumelana ne-oxidation, nokumelana nokugqokwa kwamabhodi wesekethe ukuze kuhlangatshezwane nezidingo zabo zokusetshenziswa ngezikhathi ezikhethekile.
Izici zomkhiqizo: ukusebenza okuhle kakhulu, ukusebenza kahle kwe-electrocatalytic, umthamo we-antioxidant, nokuzinza.
Amaphuzu avelele: impilo ende, ukusetshenziswa kwamandla okuphansi, ukufana okuphezulu kwe-plating, izindleko eziphansi zokusetshenziswa okuphelele, nokusebenza okumba eqolo.
Izimo ezisebenzayo: ibhodi lesifunda ipulatizo legolide
Izimo zohlelo lokusebenza: isistimu ye-electrolyte acidic/cyanide, i-gloss agent nezinye izithasiselo Au: 4-10g/L, CN: ukuhlushwa okuphansi, PH: 4-5; izinga lokushisa 40-60 ℃;
Ukuminyana kwamanje: 0.1-1.0ASD; isilinganiso 0.2ASD
Ukuthengiswa komkhiqizo ngemva kokuthengiswa kanye nesevisi: Sihlinzeka ngesikhathi kanye nekhwalithi ephezulu yokukhiqiza i-anode entsha kanye nezinsizakalo ezindala zokuhlanganisa i-anode emhlabeni jikelele.
PCB VCP DC Copper Plating DSA
Igama lomkhiqizo: PCB VCP DC Copper Plating
Uhlolojikelele Lomkhiqizo: Izinto zokunamathisela ezisetshenziswa ebhodini lesifunda eliphrintiwe (PCB) izinqubo zokukhiqiza.
Izici zomkhiqizo: ubukhulu obuzinzile, ukunamathela okuqinile, ukumelana nokugqwala, impilo ende yesevisi;
inciphisa ngempumelelo i-tank voltage, umphumela obalulekile wokonga amandla;
Ukusetshenziswa okuphansi kakhulu kunganciphisa izindleko zokukhiqiza.
Izinzuzo namaphuzu avelele: impilo ende (ingenziwa ngezifiso ngokuya ngezidingo zamakhasimende);
ukusetshenziswa kwamandla okuphansi, nomsebenzi ophezulu we-electrocatalytic.
Izimo zokusetshenziswa: i-electrolyte CuSO4 · 5H20 H2SO4; izinga lokushisa 20-45 ℃; ukuminyana kwamanje 100-3000A/m2DC;
Izimo ezisebenzayo: umugqa we-VCP/umugqa ovundlile we-copper plating, ngokusebenzisa/ukugcwalisa/ukufakwa kwe-pulse yethusi, ukufakwa kwebhodi okuthambile/okuqinile, ukufakwa kwe-semiconductor substrate;
Isevisi yangemuva kokuthengisa: Ihlinzeka ngesikhathi kanye nekhwalithi ephezulu yokwenziwa kwe-anode entsha kanye nezinsizakalo ezindala zokupenda kabusha i-anode emhlabeni jikelele.
Buka NginiUhlolojikelele Lomkhiqizo: Izinto zokunamathisela ezisetshenziswa ebhodini lesifunda eliphrintiwe (PCB) izinqubo zokukhiqiza.
Izici zomkhiqizo: ubukhulu obuzinzile, ukunamathela okuqinile, ukumelana nokugqwala, impilo ende yesevisi;
inciphisa ngempumelelo i-tank voltage, umphumela obalulekile wokonga amandla;
Ukusetshenziswa okuphansi kakhulu kunganciphisa izindleko zokukhiqiza.
Izinzuzo namaphuzu avelele: impilo ende (ingenziwa ngezifiso ngokuya ngezidingo zamakhasimende);
ukusetshenziswa kwamandla okuphansi, nomsebenzi ophezulu we-electrocatalytic.
Izimo zokusetshenziswa: i-electrolyte CuSO4 · 5H20 H2SO4; izinga lokushisa 20-45 ℃; ukuminyana kwamanje 100-3000A/m2DC;
Izimo ezisebenzayo: umugqa we-VCP/umugqa ovundlile we-copper plating, ngokusebenzisa/ukugcwalisa/ukufakwa kwe-pulse yethusi, ukufakwa kwebhodi okuthambile/okuqinile, ukufakwa kwe-semiconductor substrate;
Isevisi yangemuva kokuthengisa: Ihlinzeka ngesikhathi kanye nekhwalithi ephezulu yokwenziwa kwe-anode entsha kanye nezinsizakalo ezindala zokupenda kabusha i-anode emhlabeni jikelele.
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